As it has been ascertained the Leica X2 EVF is an Oly VF-2 with a different name and price tag on it, perhaps we can guess the M's EVF is also from Oly.
philber: CMOSIS is a design firm, not a fabricator. Maybe Leica doesn't feel that threatened since the design presumably is now theirs?
Fair concern Philber, but all they do is design and fab sensors, most of the production is automated. EDIT: oh, I see they don't even fab themselves.
Remember the old saying, too many cooks spoil the broth.
Peter Karbe is only one man. Walter Mandler was only one man.
I'm aware they have teams but the right person can drive a small team to great success and throughput.
michaelwatkins wrote:
As it has been ascertained the Leica X2 EVF is an Oly VF-2 with a different name and price tag on it, perhaps we can guess the M's EVF is also from Oly.
philber: CMOSIS is a design firm, not a fabricator. Maybe Leica doesn't feel that threatened since the design presumably is now theirs?
CMOSIS could be the guys that tweak the sensor, could be a Sony sensor with CMOSIS toppings/tweaks as per Leica request. That would require less than 42 guys I presume. Even including the janitor.
But, I am just guessing here.
End of speculation, straight from CMOSIS:
MANUFACTURING
After successful image sensor prototyping, the chip enters production. CMOSIS is a fabless semiconductor maker committing to deliver the chips at agreed specifications, schedules and prices.
We take care of the entire production flow.
CMOS image sensor fabrication involves:
Wafer manufacturing Wafer testing Wafer dicing and packaging Final device test Inventory management: wafers, packages
and cover glass, tested sensors
Wafer testing and final test of the packaged imager is done at CMOSIS in a 70 m2 Class-100 cleanroom.
DESIGN TOOLS
CMOSIS operates a state-of-the-art design environment with best-in-class tools. Installed are:
Schematic entry, simulation front-end and IC layout tools from Cadence Design Systems
Analog, digital and mixed signal simulations with Mentor Graphics AdvanceMS
High-capacity simulation capabilities with Mentor Graphics ADiT turbo
Digital block implementation with Cadence tools Hierarchical verification (DRC, LVS)
with Mentor Graphics Calibre Extraction with Mentor Graphics Calibre
and Synopsys StarRC Solid Edge for IC package design Device simulations with Cogenda Genius
and Visual TCAD GUI. Process simulation with Suprem 4 Lab for optical and reliability characterisation
UNIQUE TECHNOLOGY AND IP
CMOSIS continuously develops new image sensor tech- nology improving the performance of its image sensors. This technology supports all our image sensor products. Recent developments include:
Efficient global shutter with low temporal and spatial noise
Fast and highly accurate column ADCs High linear dynamic range in a single exposure TDI imaging in CMOS sensors Backside Illumination for (E)UV and visible range
kosmoskatten wrote:
CMOSIS could be the guys that tweak the sensor, could be a Sony sensor with CMOSIS toppings/tweaks as per Leica request. That would require less than 42 guys I presume. Even including the janitor.
Sorry Douglas, I was editing my post with the CMOSIS snippet while you were writing, the text taken from their company flyer, available on pdf. I quoted the most relevant part only.
I have to say that the M is a very interesting, and compelling camera. The simple experience of the Leica combined with the full power of a high-end mirrorless camera. Movie, live view, peaking, it combines the best attributes of existing cameras, and goes to 24MP as well. The R-M adapter, new grip system and flash bracket complete the package. Very nice. I might have to think about getting back into the M system
philber wrote:
Not that I want to sound negative on this new camera, which is deservedly well received, but CMOSIS claim 42 employees on their Website. That is an awfully small number, and it is not M sensor production that can keep them alive. So buying an M is taking a gamble on this minnow staying alive in a world of really big fish.
CMOSIS has no own fab, so the 42 people are many developers and some sales, administration people. Probably there are 30 sensor developers or such. This is not bad.
I suppose the machine vison, ITS and such sales are much bigger than those for Leica Camera.
Frankly, the more I read that this not a design-tweaked sensor manufactured in multiple flavors for multiple clients, the more skeptical I get. Semi-conductor manufacturing is a game where economies of scale matter hugely. So, if every step of the process is strictly indigenous to CMOSIS/Leica, the volume must be terribly low, and the cost commensurately high. And the fact that Leica might own the design in case its partner did run aground is not a great level of protection, because in few years Leica will require a better sensor just to stay in the game. But here's to hoping that it does indeed work out!
Special care was taken in the sensor development to reduce crosstalk between neighboring pixels for a wide range of incident light angles. The sensor reduces spatial crosstalk by its very small distance between color filters and photodiodes. This thin optical stack is optimized for an efficient light coupling into the silicon. Microlenses with a strong curvature and high top height focus the incoming light rays in the center of each pixel's photodiode. The resulting low angular sensitivity of the quantum efficiency (QE) at high ray angles was achieved by the particular features of STM's 110/90nm CMOS process. This allows the Leica M to accept the full range of high-quality lenses in the camera system, which includes wide-angle, large aperture lenses, at their full optical performance....Show more →
That last bit about lenses operating at full optical performance is a strong statement. I wonder if this means, that no software correction or lens coding is needed. If so it would be a very good development for sensors generally, and for indicating what may be possible for full-frame high-incidence designs (eg Sony).
Made by ST Micro in France
"The new custom-designed sensor chip, counting 6,000 x 4,000 pixels on a 6 x 6 ΅m² grid across the active area of 36 x 24 mm², is made by STMicroelectronics (STM) in Grenoble, France, using 300mm wafers in their IMG175 CIS technology. STM's 110nm frontend and 90nm backend CIS technology with copper metallization was originally developed for CMOS image sensors with 1,75΅m² pixels for mobile phones and other consumer applications. The large die size, larger than the reticle size, requires the use of one-dimensional stitching." http://www.cmosis.com/news/press_releases/new_leica_m_uses_cmosis_24_mp_cmos_image_sensor
Mike
I don't know who is the funny guy on this forum who came up with the AA filter story. There is no indication whatsoever of its existence. The M does not have an AA filter. The only drawback I can see so far is its availability date in February 2013, which is more likely to be September 2013.
What does "Milestone" allude to? As far as I can see there's is more of the same compared to the M9. What am I missing?
This is what they say
in fact, it is a typical m. But with Live View, video recording, and new focusing methods, it is also the m for photographers looking for the ultimate in modern digital technology. The new m successfully expands the scope of the m-System while remaining true to its fundamental principles.
Theres a decent video here demonstrating the M and accessories, including R-lenses. Definitely gives the impression of borrowing from the compact system camera philosophy.
