mcbroomf Online Upload & Sell: Off
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I'm in the same boat as CalW, with 35+ years of semiconductor manufacturing. It's difficult to understand how a curved sensor could be manufactured in the fab.
However the Sony patent doesn't call for one to be made curved, it bends it by supporting the sensor at the edge and applying a force (vacuum on the back if I recall). The notes in SAR also say that this is a BSI sensor and that is an important distinction because BSI sensors have to be thinned a LOT, and as a result will likely be able to handle the curvature without cracking. I don't know of anyone that is yet making BSI at even APSC dimensions though, so if Sony are pushing FF then they have some serious technology lead aside from the pixel itself which we all love ...
Mike
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